Industry Directory | Manufacturer's Representative
AlSi BondPads for PCB and Hybrid Packaging modules
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh
Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Technical Library | 2010-06-03 22:23:03.0
Strategies for successful design and manufacture of microwave multilayer printed circuit boards. All aspects from pad registration, dimensional stability, impedance fluctuation, fusion bonding, thermal ageing, z-axis expansion, reliability, to Young's mod
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/bonding-equipment?con=t&page=11
frame and structural bonding, to body or underbody sealing, Nordson has a dispensing solution. Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance Nordson MARCH Imaging-Bonded-Wafer-Defects-for-3D-SI-Aug2009 Nordson Corporation VersaDrum™ Bulk Melters (Heated
| https://www.eptac.com/faqs/ask-helena-leo/ask/training-in-wire-bonding
Training in Wire Bonding - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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