High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
This compact AOI system was developed to inspect medium and small product runs. During inspection, a high-resolution camera records all bond sites and wires. Dies, bond sites, wire course and component position are only a part of the inspection scope
Used SMT Equipment | In-Circuit Testers
JDSU DSAM-6300 DSAM-6300 Network Maintenance Sweep Meter with DOCSIS / EuroDOCSIS Capabilities. Combines triple-play services testing, forward and return path maintenance, and Stealth Sweep Technology to deliver award-winning performance. The DS
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2016-03-22 16:48:06.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the Las Vegas Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Career Center | , South Carolina USA | Engineering
Position is located in the upstate of South Carolina with an established, stable company. Will assist in the start-up of die bonding equipment. Will assist in the development of processes and equipment necessary to product products. Will utilize S
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Richmond, Ohio USA | Production,Technical Support
13 years experience in the electronics manufacturing industry Knowledgeable in set up, operation and maintenance of SMT machinery. Knowledgeable with programming/ editing of SMT Pick & Place machines, Screen Printers and NSpecAutomatic Optical Insp
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
bonding die attach conductive epoxy die attach cure process die attach defects die attach delamination die attach epoxy die attach equipment die attach film die attach glue die attach in semiconductor
