The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Ersa HOTFLOW 3/14e Reflow Oven Working width: 45-516 mmProcess length: 3,345 mmHeated length: 2,610 mmCooling length: 735 mmWeight appr. 1,450 kgDimension: 4,770x1,201x1,375 mm Ersa HOTFLOW 3/14e Reflow Oven Ersa HOTFLOW 3/14e Reflow Oven Dua
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Used SMT Equipment | Repair/Rework
● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
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Parts & Supplies | SMT Equipment
03045554-03 S/F-D beam for nozzle removal unit 03045735-03 PCB / CAN NC C+P20 03045754-01 INDUCTOR GR-QS-4-LF 03045848S01 S/F-D launch box 03045883-02 Component reject box S-D 03045909-02 Movable Hood, Left, Complete 03045931-02 Mov
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Parts & Supplies | SMT Equipment
03045909-02 Movable Hood, Left, Complete 03045931-02 Movable Hood Assembly Right 03046203S01 SILICON-HOSE-4,5x2,5x26 03046248-01 add-on kit cable trailing unit 03046282-01 Yello label without inscription 03046331-01 Refitting package SST34 in X-
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
03045554-03 S/F-D beam for nozzle removal unit 03045735-03 PCB / CAN NC C+P20 03045754-01 INDUCTOR GR-QS-4-LF 03045848S01 S/F-D launch box 03045883-02 Component reject box S-D 03045909-02 Movable Hood, Left, Complete 03045931-02 Mov
03045909-02 Movable Hood, Left, Complete 03045931-02 Movable Hood Assembly Right 03046203S01 SILICON-HOSE-4,5x2,5x26 03046248-01 add-on kit cable trailing unit 03046282-01 Yello label without inscription 03046331-01 Refitting package SST34 in X-
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
SMTnet Express, July 23, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Reliability Study of Bottom Terminated Components Jennifer Nguyen, Hector Marin, David Geiger, Anwar Mohammed, Murad Kurwa; Flextronics International
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10599.html
– and/or simply very large bottom-termination pads – where there is no paste recommendation in the datasheet – or in some cases, not even a basic land-pattern recommendation, or one that is obviously sub-optimal. One example
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies. The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components
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