Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Electronics Forum | Sat May 27 11:13:27 EDT 2000 | Steve Thomas
Subject line pretty much says it all. We're going to try some stencil design changes to reduce midship solder balls. Anyone have some comments on pros or cons for either?
Electronics Forum | Sat May 27 12:50:21 EDT 2000 | Micah Newcomb
Steve, I use homebase apertures as a standard for all chip parts and have no complaints, no solder beading, no issues. I have had to replace almost all stencils ordered previous to my arrival as they all caused defects (7-9mil thickness and 1:1
Used SMT Equipment | Screen Printers
MPM APB HiE 2d vision Understencil Cleaner Fine Pitch Year 2000 *Print Area: 2” x 2” to 18” x 16” *Board Size: 2” x 2” to 20” x 16” *Stencil Frame Size: 29" x 29" *Vision Specifications: Viewing Capability: 17.5” x 16” Field o
