Electronics Forum | Sat May 27 11:13:27 EDT 2000 | Steve Thomas
Subject line pretty much says it all. We're going to try some stencil design changes to reduce midship solder balls. Anyone have some comments on pros or cons for either?
Electronics Forum | Thu Jan 18 19:16:42 EST 2001 | slowe
I am having problems with D-Packs shifting during reflow. Does anyone know of a good aperture design to solve this problem ? Possibly bow tie.
Used SMT Equipment | Screen Printers
MPM APB HiE 2d vision Understencil Cleaner Fine Pitch Year 2000 *Print Area: 2” x 2” to 18” x 16” *Board Size: 2” x 2” to 20” x 16” *Stencil Frame Size: 29" x 29" *Vision Specifications: Viewing Capability: 17.5” x 16” Field o
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