Industry Directory | Manufacturer
BTC Electronics is the sole distributor for Panasonic Corporation since year 1974 .BTCE has around 490 employees & 10 wholesale branches covering all over Egypt.
Industry Directory | Manufacturer
Supplier of electronic components and interconnect products. QPL approved. Largest stocking distributor of hermetically sealed connectors. Visit our website at www.btcelectronics.com
New Equipment | Rework & Repair Equipment
This is a unique stenciling BTC (QFN , LGS, etc) rework stencil system. It improves first pass yields and allows you to rework leadless devices without high-end rework systems. This configurable part number means you do not have to sort through all
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
Used SMT Equipment | SMT Equipment
Dear sir, we are looking for Flexible Mounter Fuji AIM (2005-2009)in a good working condition. If you have suitable one for sale ,please contact us with full details Thanks Ayad Demyan ayad(dot)demyan(at)btc(dot)com(dot)eg
Used SMT Equipment | General Purpose Equipment
Espec Panelized EWPT 3468 - CCW Walk-In Temperature Chamber Brand: Espec Model: EWPT 3468 - CCW Serial#: 305536 Vintage: 2003 Power: 460V 3PH 60Hz. Temperature Control System: Balanced Temperature Control System: BTC Ambient Temperature:
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
Technical Library | 2023-01-17 17:25:14.0
BTC Void Reduction For Yield and Performance Enhancement
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting o
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,
PCBA Cleanliness End-of-Project Webinar
Career Center | , | Maintenance,Management,Quality Control,Technical Support
Software: Over 14 years experience in operating and maintaining of different types of Telecommunication and IT equipments � Proven proficiency in operating and maintaining of TDM telecommunication equipment - digital exchanges AXE10 (Ericsson) � Pr
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
SMTnet Express July 25, 2013, Subscribers: 34972, Members: Companies: 13435, Users: 34972 Using Automated 3D X-Ray Inspection to Detect BTC Defects by Barbara Koczera; Test Research USA , An Qi Zhao; Flextronics Detecting marginal joints and other
. Bottom terminated components (BTC) are le
Heller Industries Inc. | https://hellerindustries.com/video/btc-void-reduction-for-yield-and-performance-enhancement-at-smtai-2016/
BTC Void Reduction For Yield and Performance Enhancement at SMTAI 2016 - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes 中文 MEMBERS LOGIN Membership Become a Member
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