Industry Directory | Manufacturer / Manufacturer's Representative
We specialize in EMI Ferrite Core, Thermal Pads, Gaskets and shielding products.
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny
Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro
Used SMT Equipment | Repair/Rework
SPLIT VISION MICROSCOPE STEREO WILD M3Z MICROSCOPE WITH ZOOM LENS COLOR DIGITAL CAMERA CAMERA MONITOR REMOTE KEY PAD CONTROLLER AIR/NITRO INLET INCLUDES 3 EACH NOZZLES FOOT SWITCH FOR GAS FLOW TOP AND BOTTOM 800 WATT HEATERS VENTURE VACUUM SYSTEM GRO
Used SMT Equipment | General Purpose Equipment
Blue M Mechanical Convection Oven, 96 cu.ft., F4 Control Product includes the following installed options: Computer Interface: RS485 Standard with Controller Door Style: Standard Double Door Door Hinge: Standard Special ETO Option : Install leve
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Parts & Supplies | Assembly Accessories
amaha Mounter: also known as "mounting machine" and "surface mounting system", in the production line, it is a kind of equipment that can accurately place surface mount components on PCB pad by moving the mounting head after dispe
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Parts & Supplies | Pick and Place/Feeders
J44021035A PC_POWER_SUPPLY J48011017A SBC NuPRO-935A/DV &n
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
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Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom
SMTnet Express July 25, 2013, Subscribers: 34972, Members: Companies: 13435, Users: 34972 Using Automated 3D X-Ray Inspection to Detect BTC Defects by Barbara Koczera; Test Research USA , An Qi Zhao; Flextronics Detecting marginal joints and other
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
) is used to apply areas that will becomes the traces, pads, and metal ground of a printed circuit board. A dry film is applied to a copper laminate
| http://www.szhonreal.com/uploadfile/Download/202305231109343783.pdf
) *5 Conveyor extention / support pin / support sponge CE compatible specification /Ground-fault interrupter Force control unit / Force control nozzle JaNets / IFS-NX
