Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual chamber machines. Get more out of
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
Electronics Forum | Fri Nov 04 17:51:31 EDT 2016 | ttheis
I contacted btu but they told me they only have wincon version 2.0 and newer.
Electronics Forum | Fri Nov 04 17:50:52 EDT 2016 | ttheis
We have a vip oven with corrupt installation apparently but still have the configuration files. Looking for 1.05e install disks if any one has a copy to fix it. Thanks
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 100N Reflow Oven Model: Pyramax 100N Year: 2017 Left to Right Flow Edge Rail & Mesh Belt (8) Heating Zones (1) Cooling Zone Nitrogen Compatible SW: Wincon Version 6.5a Power: 208V Complete &
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 100A Reflow Oven Vintage: 2012 LOW HOURS Edge Rail Mesh Belt L to R Flow Programmable Width Adjust Smart Tracker SMEMA Bottom Cooling Fans 480V 3-Phase UPGRADE Kit Recently Added ($13k Value) - Intellimax 2 Module Assembly - Wincon 7.2 So
Industry News | 2016-04-07 09:35:22.0
BTU International will exhibit at the S.E.E. show in Stockholm, scheduled to take place April 19th-21st at the Kista Expo Center. BTU will exhibit together with its Swedish representative, Haja, highlighting the PYRAMAX
Industry News | 2017-04-22 11:25:02.0
BTU International today announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging. The event is scheduled to take place May 16-18, 2017, in Nuremberg, Germany. BTU representatives will demonstrate the PYRAMAX™ reflow oven with the WINCON™ connected factory interface in booth 4-551.
Get more out of your SMT line with Pyramax ZeroTurn. Our dual chamber reflow oven eliminates process changeover time while preserving the process control that the Pyramax family of reflow ovens is known for.
Built on the industry leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt.
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