G 5003 - LR Ink Mixer and Defoamer (Air Bubble Remover) R&D for Best Mixing Solution: Ink for Printed Circuit Boards, AB paste and Ag (Silver) paste mixing and defoaming solution. Great use for: PCB Factory, Glass Panel Factory, Photoelectric Ind
In many cases the casting process is carried out under a vacuum to prevent air pockets. Trapped air bubbles reduce heat dissipation, since air is a good heat insulator, or they give rise to disruptive electrical charges in high-voltage applications,
Electronics Forum | Tue Mar 14 20:42:24 EDT 2023 | stephendo
In a previous lifetime, we had a selective solder machine where I would see solder splashes in the roof of it. I thought someone might have been putting the solder extremely high. But when it was melting there would be bubbles that burst. The manufac
Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin
Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2024-10-06 08:00:38.0
In the world of electronics manufacturing, soldering plays a critical role. The PCB reflow oven process has revolutionized the industry by improving the quality of solder joints, especially for high-reliability applications like aerospace, automotive, and medical devices. But what exactly is this process, and why should manufacturers consider it?
Parts & Supplies | Air / Vaccuum
ORIGINAL SMT MACHINE PARTS JUKI FX-3 SOLENOID VALVE ASSY 40047589 M3QB140-M5-D2NAH-6-FL424810-3 JUKI Nozzle Specifications: Brand Name JUKI VACUUM Part Number 40047589 Model Number M3QB140-M5-D2NAH-6-FL424810-3 Ensure Tested buy juki Guaran
Parts & Supplies | Assembly Accessories
> JUKI E32707290A0 EJECTOR UNIT JUKI E32717290A0 EJECTOR UNIT IC JUKI E3271760000 SOLENOID VALVE JUKI E3272729000 SOLENOID VALVE JUKI E3272760000 CYLINDER JUKI E3273729000 FILTER ELEMENT JUKI E3273760000 SPEED CONTROLLER JUKI E3274729000 SWIT
Technical Library | 2021-12-31 06:55:24.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
Technical Library | 2021-12-31 06:56:02.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
2 containers of 500g at the same time container diameter:60~66mm for details: www.jwide-smt.com or Mail: sales@jwide-smt.com
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
Air Bubbles or Voids in Solder Joints - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-pcdseries.php
main fluid reservoir. Air bubbles in the fluid path can compromise the dispense process as they result in gaps or unsatisfactory dispensing
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