New Equipment | Board Handling - Conveyors
Microcomputer control, stable and reliable. >LCD screen display, menu interface, the man-machine dialogue is convenient. >Many sound-light alarm function. >So can use standard feeder, strong commonality. >According to the thickness of the PCB so
Contact us Sales manager: Yuki Mobile: +8617359287459 Email: sales15@amikon.cn Skype: live:498b014e476a7ffd WhatsApp: +86 17359287459 Website: https://www.amikonplc.com/ Add: Siming District, Xiamen, Fujian, China Products info Product ID:
Electronics Forum | Thu Oct 31 11:08:12 EST 2002 | soupatech
Being very new to SMT I won't assume I know what the problem is but.... I had lots of air pockets in solder joints, 95% of the boards. Everyone I spoke to thought it was a problem with my process but when one board was sent to our supplier they admi
Electronics Forum | Tue Mar 14 12:16:10 EDT 2023 | proceng1
Are these molten solder bubbles, or another substance "foaming" up on the surface?
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2011-02-07 15:23:56.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2001-04-24 10:44:24.0
This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias.
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
The new LiquiPrep material preparation and feeding unit https://www.scheugenpflug-dispensing.com/en/news/press-releases/article/the-new-liquiprep-material-preparation-and-feeding-unit-415.html Scheugenpflug has launched a new generation of its prov
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Aug 27 00:00:00 EDT 2020 - Fri Aug 28 00:00:00 EDT 2020 | ,
Foaming in Your Cleaning Process?
Ground Pours - To Pour Or Not To Pour? Ground Pours - To Pour Or Not To Pour? Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/include-via-in-thermal-pad-footprint_topic2990.html
Include Via in Thermal Pad Footprint - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Include Via in Thermal Pad Footprint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
. Let’s take a look at the IPC standards. IPC Standards IPC-HDBK-830 – Long Term Reliability and Testing Section 12.1.5 – Bubbles The presence of bubbles in a conformal coating is a factor in air entrapment, outgassing, mixing and/or application methods
