New Equipment | Board Handling - Conveyors
Microcomputer control, stable and reliable. >LCD screen display, menu interface, the man-machine dialogue is convenient. >Many sound-light alarm function. >So can use standard feeder, strong commonality. >According to the thickness of the PCB so
Pump UP your material quality! There’s no denying it: Electronic components have to work. An optimal dispensing performance as well as an absolutely homogeneous and bubble-free material are the prerequisites for this. The new LiquiPrep LP804 s
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Technical Library | 2018-09-10 08:44:08.0
Issue: Moisture and bubbles in your dispensing material with larger quantities Solution: Scheugenpflug’s 55-gal Barrel Agitator Station Barrel agitators for casting resins take their technology from the paint sector. They fall short of meeting the special demands of the auto, medical, aeronautics and electronics industries. They can’t guarantee a solid seal on the barrels – often containing expensive, moisture sensitive resins – allowing the humidity of the surrounding environment to damage the material. Also, conventional barrel agitators, as opposed to smaller units, cannot work in a vacuum to process materials directly.
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Quality control in conformal coating applications is vital for ensuring the reliability and longevity of electronic products. Conformal coatings protect printed circuit boards (PCBs) from environmental factors like moisture, dust, and chemicals. To m
2 component potting and dispensing in PCB housings encapsulating 2K adhesive AB material machine Two component glue dispensing machines are essential tools in various industrial sectors, designed to efficiently manage the application of epoxy,
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Aug 26 18:30:00 UTC 2020 - Thu Aug 27 18:30:00 UTC 2020 | ,
Foaming in Your Cleaning Process?
Events Calendar | Mon Feb 24 18:30:00 UTC 2020 - Mon Feb 24 18:30:00 UTC 2020 | Boxborough, Massachusetts USA
Chapter Technical Meeting: Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Ground Pours - To Pour Or Not To Pour? Ground Pours - To Pour Or Not To Pour? Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/include-via-in-thermal-pad-footprint_topic2990.html
Include Via in Thermal Pad Footprint - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Include Via in Thermal Pad Footprint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
. Let’s take a look at the IPC standards. IPC Standards IPC-HDBK-830 – Long Term Reliability and Testing Section 12.1.5 – Bubbles The presence of bubbles in a conformal coating is a factor in air entrapment, outgassing, mixing and/or application methods
