New Equipment | Board Handling - Storage
PROMATION offers a servo driven "Extend to Deliver" passageway shuttle station. The shuttle gate provides a normally open pathway (800 mm) and extends to deliver product when available. The shuttle gate uses 3 look across sensors and bump detection
Electronics Forum | Sat Feb 20 20:24:40 EST 2021 | sync40
Hello Ameen, It is needed a moderate impact bump to generate skew. Even blowing of the fans generally cannot generate serious skew -unless the pads apertures are not suitable for the components size/weight. You can try for yourself. Take a board wi
Electronics Forum | Tue Nov 27 16:18:34 EST 2001 | MikeF
Can anyone give me a brand name on a chair with casters that only rolls when it has weight on it? A couple of jobs ago we had chairs for the operators that would only roll after someone had sat down, that way they would not roll away while someone wa
Used SMT Equipment | Chipshooters / Chip Mounters
Dear All , We currently have 3 units YSH20 available in our stock, if you have any interesting, please contact me. Applicable PCB L50 x W30 to L250 x W200mm ****Up to L340 x W340mm" is applicable. Please contact us separately. Mounting c
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
Parts & Supplies | Pick and Place/Feeders
Product Description: Product Name: Philips smt feeder station(with power supply) Product Size (mm): L120*W230*H250 Brand:Philips Devices Number : Install one FEEDER Applicable models: Philips Series models Weight: About 6KG This product is ma
telescopic lifting conveyor /gateway telescopic conveyor/PCB conveyor, https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/1PCB Telescopic lifting conveyor is used to make passage in the PCB intelligent assembly line to give the opera
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D
ASCEN Technology | https://www.ascen.ltd/Products/pcb_custom_conveyer/315.html
(3 locations). Accidental Bump Bar with Auto Retr Specification ASCEN team provide a full SMT assembly line solutions,including
