We have various euipment avilable: Re-flow ovens Tape & Reel Inpsection Test Marking Probers Ovens - Burn-in, Temp Cycle, Thermal Shock, Humidity and temp.
Can be used for QFP device functional test and Burn-in test
Electronics Forum | Wed Nov 03 04:50:05 EDT 2010 | jacki
Dear all is there anyone knew about burn-in process and what type of solder must be used for burn-in-board? And, what the maximum temp during burn-in process? Thanks in advance.
Electronics Forum | Mon Dec 01 07:37:07 EST 2008 | snaggletooth
PCBA Burn-in testing: We need to test some products from -40c - +71c and need some testing equipment for it. We have some burn-in equipments but not at the this temperature range and not at the 7c per minute change rate that is needed. Anyone have so
Used SMT Equipment | General Purpose Test & Measurement
The Keithley 2100 is a high precision low-cost USB-based instrument well suited for a wide range of production test, burn-in, manual and semi-automatic R&D applications in bench, portable, or small system measurement configurations. The Model 2100 co
Used SMT Equipment | In-Circuit Testers
Keithley 2100 Model 2100/120 6 1/2 -Digit USB Digital Multimeter - 120V The Keithley 2100 is a high precision low-cost USB-based instrument well suited for a wide range of production test, burn-in, manual and semi-automatic R&D applications in
Industry News | 2018-10-18 08:37:41.0
How to optimize the reflow profile?
Industry News | 2011-08-24 13:20:32.0
Multitest’s Burn-in Product Group has received a multiple repeat order for burn-in boards from a large European IDM for automotive devices.
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
How to select and install a vacuum tip and pick and place a part using the pen-vac
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Career Center | Irvine, California USA | Quality Control
In Process Testing / QA Inspector In-circuit testing of SMD type assemblies Functionally test SMD type assemblies Visually inspect SMD type assemblies Load and unload (burn-in, etc.) Must be physically fit, able to lift up to 10 pounds Must have goo
Career Center | Lewiston, Minnesota USA | Engineering,Technical Support
Responsibilities: Maintenance and repair of test and burn-in equipment Troubleshooting of tested assemblies Creating and updating of test procedures Communicating directly with customers Interaction on internal customer support t
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