Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
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Industry Directory | Equipment Dealer / Broker / Auctions
Auctioneers, Evaluators & Liquidators. From individual machines to complete facility closings, C3 has been around for 70 years providing value to the secondary marketplace. Find out more about us at www.C3.com.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Electronics Forum | Thu Jul 30 14:47:52 EDT 2015 | tombstonesmt
We have three C-740 machines. Parts can be bought directly from Asymtek in California.
Electronics Forum | Sun Jul 12 23:14:17 EDT 2015 | giulius58
Hy guys, someone know Asymtek C740? I want to overaul a part o his. thanks
Used SMT Equipment | Soldering - Wave
1997 Soltec 6622C Wave Solder Machine Features: N2 Capable o Internal Fluxer o Cascade o Rotary & Chip Wave o 3 Zone Bottom Convection Preheaters
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2017-08-19 13:31:56.0
GPD Global will demonstrate its Hyperion dispense system in booths 1C03 & 1C10 at upcoming NEPCON South China 2017. This fully automated dispense platform incorporates the latest technology from GPD Global in a compact footprint. Equipped with linear motor drives, smart pump technology, full touch screen interface, vision centric system operation & more, this is a dispense system not to be missed.
Parts & Supplies | Pick and Place/Feeders
This item is included in the August 21-24 Online Auction. Please visit the following website for all of the details. http://bajabid.hibid.com/catalog/108607/august-2017-online-auction/?cpage=2
Parts & Supplies | SMT Equipment
P10143 VALVE of MPM/MOMENTUM MPM / MOMENTUM; 125 solenoid valve P10143 VALVE Machine Model: MPM Momentum; 125; Momentum +; Momentum Elite MPM / MOMENTUM; 125 mouse P9229 MPM / MOMENTUM; 125 Thimble 9061M SUPPORT PIN MPM / MOMENTUM; 125 P10468
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Fri Sep 08 00:00:00 EDT 2023 - Fri Sep 08 00:00:00 EDT 2023 | Chihuahua, Mexico
I.C.T Boosts Technological Advancements: Sponsors SMTA Exhibition in Mexico
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Atlanta Chapter: Tech-Day
Career Center | bargain face-to-face, California USA | Engineering,Maintenance,Sales/Marketing,Technical Support
I.C.T Global Localization Recruitment | Join Our Team Today! We are actively seeking talented individuals from around the world to join our team. Take a look at the following positions available: 1. Senior SMT Engineer: 3 people 2. SMT Service E
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | , India | Maintenance
Have worked in ELECTRONICS MANUFACTURING & SEMICONDUCTOR industry for 8+ years for machine maintenance worked with TDK CORPORATION (EPCOS PTE LTD) IN SINGAPORE FOR SEMICONDUCTOR worked with NOKIA INDIA PVT LTD IN INDIA FOR SMT MACHINE MAINTENANCE
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_conveyors_cpak.html
C Pak Creative Packaging Shrink Tunnel Sealer Serial Number: 598701 Model Number: 3230 Year 2005 Tunnel Opening: 32" wide x 30" tall Mesh Belt Conveyor System Leveling Legs Precision heat control and main control ciruit breaker 220 volt Excellent Condition - Only used a few time Working - Connected - Calibrated
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/30685901-c-c-service-wrench-216869?page=203&order=name+asc
UNIVERSAL C&C service wrench 30685901 | QYSMT × Home about Us FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products C
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