GE 4C-A convex probe(2 no.s) used with GE Voluson 730 machine for immediate sale.
PART No. 40222 42100 42102 48222 72601 72602 72603 72604 73200 73351 74501 74503 78302 02-513-123KIT 1219-13004 1219-130T4 1219-44003 1219-44003-030 1219-440B3 1219-440T3 1219-66203 1219-86203 1224-00200-004 1224-40200 190-820 246-226 246-227 246-22
Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
Electronics Forum | Mon Nov 07 08:27:56 EST 2005 | chunks
It could be you are drying out your solder paste. Most flux formulations are alcohol based and after a few hours can dry out. This can can lead to dewetting and solder balling as well. Especially if you do not homeplate your R's and C's. A simple
Used SMT Equipment | THT Equipment
We are looking for 2 units of Panasert -MV2C－A please kindly offer and provide machine spec if you have available. My skype :cherst2008 MSN：chenping_2006@hotmail.com H.P.86-15899854903 you can email me at cherst2008@126.com too
Industry News | 2003-05-02 08:58:57.0
Bob Ferguson has been appointed PWB General Manager, North America.
Industry News | 2013-02-19 18:42:04.0
IPC — Association Connecting Electronics Industries® announces the appointment of John Hasselmann as its new vice president of government relations.
Parts & Supplies | SMT Equipment
YMH Cylinder Part Name：CYLINDER (YV导轨夹板气缸) PART No：KG7-M9236-10X Part Name：PCB顶针气缸 PBDA6*40 PART No：KG7-M9176-00X Part Name：PACKING 90990-22J006 (L043165) PART No：90990-22J006 Part Name：PACKING SEF 1 KM5-M7174-701( 1&8#平垫 ) PART N
Parts & Supplies | Pick and Place/Feeders
YMH Cylinder Part Name：CYLINDER (YV导轨夹板气缸) PART No：KG7-M9236-10X Part Name：PCB顶针气缸 PBDA6*40 PART No：KG7-M9176-00X Part Name：PACKING 90990-22J006 (L043165) PART No：90990-22J006 Part Name：PACKING SEF 1 KM5-M7174-701( 1&8#平垫 ) PART N
Technical Library | 2021-01-21 02:04:27.0
Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour.
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Category: 34A C.A. Picard XSF-2700A Optical Single Hole Artwork Registration Punch Sold at TRC Circuits on 11/30/2022 Vadnais Heights MN Previous Item Next Item Lot Number: 34A Description: C.A. Picard XSF-2700A Optical Single Hole Artwork Registration Punch
