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170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Electronics Forum | Tue Nov 18 21:00:02 EST 2003 | davef
There may have been something like that in the past, but now-a-days the IPC says stuff like, "make sure the temperature that you use to not adversely affect the performance of the components." [er words to that effect] Probably, the "260*C / 10 seco
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
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Industry News | 2017-08-19 13:31:56.0
GPD Global will demonstrate its Hyperion dispense system in booths 1C03 & 1C10 at upcoming NEPCON South China 2017. This fully automated dispense platform incorporates the latest technology from GPD Global in a compact footprint. Equipped with linear motor drives, smart pump technology, full touch screen interface, vision centric system operation & more, this is a dispense system not to be missed.
Industry News | 2009-06-10 12:25:54.0
Etek Europe Ltd shall be attending the National Electronics Week on the 16th to 18th June at Earls Court in London. We shall have a range of our equipment on display on our booth, C10.
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