Industry Directory | Manufacturer's Representative
We offering cutting edge software based on machine cycle calculations that handles true 3D models.
Industry Directory | Distributor
Allchips is a professional electronic components supply chain service platform, supported by over 1000 original manufacturers & authorized agents, and more than 10,000,000 products data.
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
The TH-2004kB has a bright four-digit LEDscreen and automatically cycle, "teach & learn" function suitable to dispense for mass production or for the products which are required high precision. Precision Tolerance:0.001S Features: 1.Manual
Electronics Forum | Mon Apr 08 20:43:58 EDT 2002 | davef
Regardless of the design technology of the board, we use shop floor management software that: * Calculates the period that it takes to assemble a job. Obviously, we enter product-manufacturing information [ie, BOM, material receipt dates, process fl
Electronics Forum | Mon Mar 30 01:53:15 EDT 2020 | franknguyen
Hi, I have 2k test points need to test by Flying Probe. How can I assume the test cycle time for this? (I use Takaya Flying Probe)
Used SMT Equipment | Adhesive Dispensers
Fuji GL541E *Basic Specifications Cycle time 0.09 seconds/dot Travel distance - X-axis within 8mm Y-axis within 6mm Needle up/down distance of 8mm Application time: 0.05 seconds Dispensing accuracy: +/- 0.15mm in th X and Y directions (3 sigma)
Used SMT Equipment | Pick and Place/Feeders
Product Details: Universal HSP 4796R-0-10530 Vintage: 10/2000 Cycle Count: 2 314 602 Power on time : 7492:46'05" AUTO on time : 4745:26'36" Stop time : 2747:20'55" Set up time : 157:44'15" test mode time : 0:05'02" - Max. 80 feeders (if only 8mm
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
Technical Library | 2021-07-28 18:35:13.0
The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch
Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows: These are the components package specifications. Functions: 1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Tampa, Florida USA | Accounting/Finance,Production,Purchasing
Reptron Manufacturing Services needs an experienced Assistant Buyer/Planner for their large contract manufacturing facility. The qualified candidate must be a self-starter with an understanding of PC board manufacturing and component procurement with
Career Center | San Jose, Nationwide | Engineering,Management
This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
GPD Global | https://www.gpd-global.com/pdf/doc/Advanced-FPC-Real-Time-Controller-User-Guide-22940009.pdf
cycle can occur. Setting Dot mode time (ex. 250ms) Process Image DotRunDuration=250 ASCII Command dtrs=250 Determine when Dot completed Monitor the pump busy signal or register to determine when a Dot activation has completed. 0 = not busy (completed) 1
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/n610022081aa-ring-i-o-load-board-cycle-timer-type-187959?page=66&category=1111&order=name+desc
PANASONIC RING I/O LOAD BOARD(CYCLE TIMER TYPE) N610022081AA | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products AI SPARE PARTS RING I/O LOAD BOARD(CYCLE TIMER TYPE
