Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider / Manufacturer
Total electronic product design and manufacturing services, design and engineering, prototyping and NPI, PCB assembly.
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
SMT Offline AOI Inspection Machine ZW 500 Dimension:900*1100*1350 mm PCB width:30x30-450x330mm Inspection Component: 0402 chip Weight:Aprox. 450kg Product description: SMT Offline AOI Inspection Machine ZW 500 INQUIRY SMT Offline
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Technical Library | 2021-07-28 18:35:13.0
The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
With the global industrial transformation, I.C.T entering Industry 4.0 intelligent MES system management helps customers improve production efficiency, shorten production cycle, and achieve comprehensive scientific traceability management, so as to q
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Tampa, Florida USA | Accounting/Finance,Production,Purchasing
Reptron Manufacturing Services needs an experienced Assistant Buyer/Planner for their large contract manufacturing facility. The qualified candidate must be a self-starter with an understanding of PC board manufacturing and component procurement with
Career Center | Van Nuys, California USA | Production
We are an ISO 9000, AS 9100, ISO 13485 and NASA certified; Quick Turn, High Reliability, Contract Manufacturer of PCB assemblies, located in the San Fernando Valley. We serve the aerospace, military, space, medical and telecommunications and other L
Career Center | Bangalore, Karnataka India | Engineering,Management,Production,Technical Support
1)Preparing project schedules / plans, engineering designs / drawings and technical specifications for smooth execution of projects. 2)Project study, estimation & Quote preparation. 3)Factory costing for volume manufacturing. 4)Turn Around Time(TAT)
Career Center | , Gjirokaster Philippines | Engineering,Production,Quality Control,Research and Development,Technical Support
TEST Engineer FOXCONN(Hon Hai Precision Ind., Ltd., Co)-formerly AMBIT Microsystems Co. Inc. Research and Development Center 5F-1 No. 5, Hsin Ann Road, Science-Based Industrial Park, Hsinchu City, Taiwan, R.O.C. General Job Functions: PCBA Testing u
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/how-dynalab-switched-to-aoi
) and telecommunications industries. The company's customers receive: on-time delivery, quick response, flexibility, short cycle times, high quality, customized program and technical support, and an overall good value
| https://www.smtfactory.com/I-C-T-High-end-AOI-Machine-and-X-Ray-Chip-Counter-id47378747.html
I.C.T High-end AOI Machine and X-Ray Chip Counter Views: 0 Author: I.C.T Publish Time: 2022-12-02 Origin: Site Inquire With the global industrial transformation
