Industry Directory | Manufacturer
The Future of Electronics is here - With Squink at your Desktop, print and assemble PCBs in minutes instead of weeks for less than a cup of coffee. Go from CAD design to PCB without the pain and cost.
Industry Directory | Manufacturer's Representative
Supreme PCB is A professional PCB Supplier from Asia. We are specialized in Quick turn High mixed Low to medium volume production. We have a vast customer base from various sectors, ie: Industrial equipment, Medical, Automotive.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Fri Sep 25 16:38:56 EDT 2009 | esoderberg
empf issued an excellent study of calculated solder volume in the 90's. It used lotus 123 but is easily used in excel. I have used it for over 10 years. The only thing wrong is with leadless components. the amount of paste required generally is insuf
Electronics Forum | Tue Sep 22 10:05:00 EDT 2009 | roland_grenier
Does anyone know how to calculate solder paste volume required to run a PCBA on an SMT line? I'm looking for a solder paste volume model which include paste waste. Roland
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Career Center | Orlando, Florida USA | Sales/Marketing
We are looking for a full time field sales representative to join our growing team of professionals offering manufacturing equipment and supplies to the Electronics Manufacturing Industry. This is a new sales position that has been created due to gro
Career Center | Fort Worth, Texas USA | Production
The requirements for the Manufacturing Engineer are a BS in Engineering with surface mount device(SMD),surface mount technology (SMT) thru-hole, and wave solder knowledge. Also, experience in fixture design, developing manufacturing processes and rel
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 4, (#ts#)) SMT Express, Issue No. 6 - from SMTnet.com Volume 1, Issue No. 6 Wednesday, November 24, 1999 Featured
SMT Express, Issue No. 6 - from SMTnet.com Volume 1, Issue No. 6 Monday, November 22, 1999 Featured Article Return to Front Page Rework Management and Optimization Learning how to manage the amount of time and money spent on rework can increase
Heller Industries Inc. | https://hellerindustries.com/1913mk7-2/
High Volume Reflow Oven -1913 Home » 1913MK7 1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/072419-lubrication-systems-standard-vs-low-volume-low-pressure
Lubrication Systems: Standard vs. Low Volume Low Pressure Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
