Through Hole Basic Switch Modules, Plunger for Cap, PC Pin Terminals. The Unimec switch range is one of the smallest two pole switches available today. The contacts are capable of producing eight functions depending on the PCB layout. The Unimec sw
For everything from high volume, low cost capacitors to application specific ceramic solutions, Johanson Dielectrics has you covered. The mission of the Johanson Companies is to translate our customer needs into quality electronic components, produ
Electronics Forum | Fri Jul 09 19:09:52 EDT 2010 | rway
A couple of things: Does the cap break if you try to remove it with hot air? If not, than you are breaking the caps do to mechanical stress. We have had similar issues. I don't think your board is suffering from mechanical stress from depaneling o
Electronics Forum | Mon Feb 17 18:53:34 EST 2020 | richgreen01
Hi all I am experiencing z force sensor errors on a couple of different nozzles ( not hydra ) any help appreciated.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2001-11-16 08:27:03.0
In Manufacturing Equipment
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Career Center | , Colorado USA | Management,Production,Sales/Marketing
Full turn key Contract Electronics Manufacturer has immediate need for a Regional Sales Manager to cover the Western US. Very financially stable and profitable company with design, proto-type and production capabilities and excellent management team
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/packaging/cap-straw-coupon-attachment?con=t
Cap, Straw, and Coupon Attachment | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories - Auxiliary Equipment
Lewis & Clark | http://www.lewis-clark.com/
: Windows XP 12 Tons Board Capacity: 36 x 48″ PC controlled servo electric press for fine control of speed, force and height up to 12 tons [107 kN
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