Industry Directory | Manufacturer
The Original Manufacturer of smt machines and THT machines since 2003 ,We design the both the software and hardware by ourselves and manufacture in our company , the only one in China who can make the smt machines by itself .
Distribute, buy and sell obsolete components, clone obsolete components like KSY10, develop electronics and software
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Tue Apr 17 10:22:16 EDT 2001 | tom g
Has anyone out there had solder joint wetting issues with Murata ceramic chip caps, in particular with Alpha UP78 no-clean paste? We are finding that changing either the paste or the vendor corrects this problem. If so, please advise your solution(
Used SMT Equipment | Soldering - Reflow
22”/26” Cap. 60 CM/Minute Heating Oven w/ Encoder. S/N 0401DA1A1-28584 An auction item. Auction: January 13 - 18, 2016
Used SMT Equipment | Soldering - Reflow
Rehm Siflow Model 3300 Reflow Oven, Nitrogen Capable, w/ AEC Application Engineering PSA Series Air Cooled Portable Water Chiller Model PSA-3Q, S/N 30H0107, Armstrong Series HC4000 HumidiLean Humidifier w/ Assoc. Oven Coolers & Filters, Wesco 440-Lb
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
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Parts & Supplies | Pick and Place/Feeders
DEK - SPARE PARTS Squeegee Blade 250mm 03128589 - 133584 DEK squeegee blade 250mm 133584 | QYSMT dek horizon 03ix, dek screen printer, dek printer, dek 03ix, dek parts, dek horizon, dek generator parts, asm dek printer, dek solder paste printer, 13
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Hot Nitrogen For Wave Soldering SMTnet Express July 5, 2012, Subscribers: 25307, Members: Companies: 8910, Users: 33309 Hot Nitrogen For Wave Soldering First published in the 2012 IPC APEX EXPO technical conference proceedings. by: Laurent
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2523&OB=ASC.html
: 2 Post Options Post Reply Quote bsulzer Report Post Thanks(0) Quote Reply Topic: Land Pattern / Solder Joint Goals Posted: 09 Sep 2019 at 4:05am Hi everybody. I am quite sure to remember the least toe value for rectangular end cap equal or lager than 0603 to be
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
top of the component. Cylindrical End Cap terminations, due to their design, allow more capillary action up into the center of the circle of the end cap, which by its circular shape, allow narrower solder collection on
