New SMT Equipment: capacitor crack during encapsulation process (31)

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

New Equipment | Rework & Repair Equipment

BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It

BEST Inc.

ab component adhesive potting and encapsulation machine for PCBa assembly

ab component adhesive potting and encapsulation machine for PCBa assembly

New Equipment | Dispensing

AB component adhesive potting and encapsulation machine for PCBa assembly  Product Description CCD Vision Dispensing Systems: Revolutionizing accuracy and quality control, CCD vision dispensing systems integrate advanced imaging technology with pre

Guangzhou Daheng Automation Equipment Co.,LTD

Electronics Forum: capacitor crack during encapsulation process (35)

Stress induced during V-score depaneling

Electronics Forum | Mon Jun 13 13:35:08 EDT 2011 | travishemen

Hello, does anyone have any information on stress induced during V-score depaneling. We are using a machine with a fixed blade on the bottom and a free rotating blade on top driven by a motor. We have had some cracked capacitors on the edge of an a

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 11:28:11 EDT 2005 | LeeHoMa

hi Steve/Pete, Thank for your email to affirming our current mounting and soldering flow! In fact, I also don't see any problem for the pilot run(though in small volume - 500pcs). However, the problem is - I am challenged by my customer that the AI

Industry News: capacitor crack during encapsulation process (8)

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

Technical Library: capacitor crack during encapsulation process (3)

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Technical Library | 2022-09-25 20:03:37.0

Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.

NASA Office Of Safety And Mission Assurance

Solder Crack Counter Measures

Technical Library | 2023-11-27 18:19:40.0

This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.

TDK - Lambda Americas

Videos: capacitor crack during encapsulation process (1)

YINCAE SMT 266 Jetting Application Process

YINCAE SMT 266 Jetting Application Process

Videos

http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process

YINCAE Advanced Materials, LLC.

Express Newsletter: capacitor crack during encapsulation process (985)

SMTnet Express - October 28, 2021

SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock

Partner Websites: capacitor crack during encapsulation process (4)

Publications

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications

.   Microelectronics - Bonded Wafer Microelectronics - Chip Capacitor Microelectronics - Chip Scale Package Microelectronics - Flip Chip Microelectronics - Hybrid/MCM/SIP Microelectronics - IGBT Power

ASYMTEK Products | Nordson Electronics Solutions


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World's Best Reflow Oven Customizable for Unique Applications


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