Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Fabrication Services
8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar
Electronics Forum | Thu Jun 08 11:05:27 EDT 2017 | davef
By the way that you stated your question, I assume that you want to do something different with the carbon inked pads. If that's incorrect, instead of removing your carbon ink, considering printing an insulating layer over the ink.
Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
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Parts & Supplies | Assembly Accessories
LAS Y Motor Belt Belt Y-Motor 330 mm 5322 358 31302 .. 5322 358 31302 Sensor ..5322 132 00056 TRANSMITTING SENSOR 8MM FOR FEEDER ..5322 132 00103 Transmitting Sensor 12mm ..5322 132 00105 Receiving Sensor 12mm ..5322 132 00106 Transmitting Senso
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Parts & Supplies | Assembly Accessories
LAS Y Motor Belt Belt Y-Motor 330 mm 5322 358 31302 .. 5322 358 31302 Sensor ..5322 132 00056 TRANSMITTING SENSOR 8MM FOR FEEDER ..5322 132 00103 Transmitting Sensor 12mm ..5322 132 00105 Receiving Sensor 12mm ..5322 132 00106 Transmitting Senso
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
SMTnet Express, November 3, 2016, Subscribers: 26,550, Companies: 15,009, Users: 41,360 A Novel Method for the Fabrication of a High-Density Carbon Nanotube Microelectrode Array Adam Khalifa, Zhaoli Gao, Amine Bermak, Yi Wang, Leanne Lai Hang Chan
KingFei SMT Tech | https://www.smtspare-parts.com/buy-smt_filter-page5.html
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
surfaces prior to reflow. 1244 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2377-5726/22/$31.00 ©2022 IEEE DOI 10.1109/ECTC51906.2022.00199 mailto:Yue1.Deng@intel.com mailto:xzhao@hellerindustries.com During the reduction of metal oxides by formic acid, carbon monoxide, carbon dioxide, hydrogen gas, and water are generated as by-products
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