Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Sat Dec 16 09:42:41 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefo
Electronics Forum | Wed Apr 26 19:10:43 EDT 2023 | cyber_wolf
This machines support table looks similar to AP and UP machines. I believe MPM published the dimensions of the "H" tower that the dedicated plates bolts to. As far as the plate, they are typically (2) pieces with the inside hollowed out to allow for
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2011-09-28 19:07:01.0
Count On Tools introduces new shipping options and an online shipping calculator, allowing customers to customize the shipping process for online orders.
Parts & Supplies | Pick and Place/Feeders
CP7 vacuum pipe DGPH5650 DCPH0261 DGPH0090 Manufacturer wholesale price supply Fuji placement machine CP7 vacuum tube DGPH5650, DCPH0261, DGPH0090 Model: FUJI Mounter Specifications: DGPH5650, DCPH0261, DGPH0090 Part number: DGPH5650, DCPH0261,
Parts & Supplies | Assembly Accessories
DEK CARRIER^BOARD CLAMP 158815 158815 CARRIER BOARD CLAMP TRANSPORT RAILS 500 ..03128595 2010 Y Cable Carrier E2057729000 2020L X axis cable carrier 40008068 2030E YR cable carrier E2169729000 2030E YR cable carrier link E2170
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2021-12-03 01:22:50.0
CNC machines is the abbreviation of "Computer Numerical Control" machines. It is an automatic machine tool with program control system. The control system can logically process the programs with control codes or other symbolic instructions, decode them and express them with coded numbers. Next, the coded numbers will be input into the numerical control device through the information carrier. After calculation and processing, the numerical control device sends out various control signals to control the action of the machine tool. CNC machine can automatically produce parts or other products according to the shape and size specified by the drawings.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand
Assembly Technology Expo
Career Center | Chesterland, Ohio USA | Production
Surface Grinder/Lapper Operator Position Overview We currently have an excellent career opportunity for a Surface Grinder/Lapper Operator to join our Ceramics team at our Channel Products, Inc. facility in Chesterland, OH. This position is respons
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Sales/Marketing,Technical Support
PROFESSIONAL EXPERIENCE Manufacturing Engineer August 1991 - January 2014 * Read blueprints, wiring diagrams, schematic drawings, or engineering instructions for assembling electronics units, applying knowledge of electronic theory and component
SMTnet Express, June 7, 2018, Subscribers: 31,097, Companies: 10,956, Users: 24,801 Potting Under Vacuum or Atmosphere? Scheugenpflug; Scheugenpflug Inc. Potting under vacuum or atmospheric conditions? This question about the correct procedure
Lewis & Clark | http://www.lewis-clark.com/product-tag/vacuum-wipe/
: Software is Windows NT Y snugger tooling and Gel-Flex kit – also assorted vacuum dams and tooling pins 2D inspection Vacuum wipe with solvent kit Machine was also configured with the 66” rails. Ready To Buy? Let Us Know! First Name (required) Last Name (required) Company (required) Title (required) Email (required) Phone (required
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11928312-carrier-tape-splicing-smt-splice-tool-cart-smt-splice-cart.html
Carrier Tape Splicing SMT Splice Tool Cart SMT Splice Cart Leave a Message We will call you back soon! Your message must be between 20-3,000 characters