Catalyst Semiconductor, Inc. designs and markets a broad range of products, including Flash Memories, EEPROMs, NVRAM, Digitally Programmable Potentiometers and Supervisory circuits. Catalyst ICs are available in lead-free, halogen-free packages.
Industry Directory | Manufacturer
full service EMS provider for the industrial, medical, security/military, and telecom/datacom marketplaces. We specialize in the manufacture of low to medium volume, medium to high mix EMS requirements including prototype and quick-turn requirements
Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,
Technic Releases TechniCatalyst AT4608 A New High Performance Palladium Activator for TechniPad ENIG, ENIPIG and ENEPIG Plating ProcessesCranston RI, USA – Technic has announced the release of TechniCatalyst AT4608, a high performance palladium acti
Used SMT Equipment | General Purpose Test & Measurement
Catalyst SBAE20 Standalone Bus Analyzer/Exerciser Unit The SBAE20 is a standalone bus Analyzer/Exerciser unit for use with USB 2.0 systems. It is designed for the complex testing and verification required for USB hardware and software system valida
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2020-11-24 00:27:11.0
Research on non-precious metal catalysts. Research progress of non-precious metal catalysts for proton exchange membrane fuel cells
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Ultrasonic spraying equipment is a spraying equipment developed specifically for glass, thin film batteries, touch screens, fuel cells, nano materials, etc. It has the advantages of high spraying efficiency, low flow rate (controllable), uniform spra
Events Calendar | Tue Jul 02 18:30:00 UTC 2024 - Tue Jul 02 18:30:00 UTC 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Events Calendar | Mon Aug 25 18:30:00 UTC 2025 - Wed Aug 27 18:30:00 UTC 2025 | Sao Paulo, Brazil
The smarter E South America
Career Center | San Jose, California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Quarte
Career Center | , California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Lead Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Q
Career Center | , USA | Sales/Marketing
A Sales and Marketing professional with broad experience in Semiconductor, Hybrid, SMT capital equipment and Consumable materials. Highly adept in emerging technologies and new product deployment. A catalyst in shaping strategy and tactics to succes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2023/04/mk7_brochure_en.pdf
. In close cooperation with our advanced materials provider, HELLER’s new low temperature catalyst can help remove flux during reflow resulting in a clean process chamber. Low temp
