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Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Fri Mar 21 21:13:03 EST 2003 | iman
Russ, u mean excess flux causes "blow hole" defect?
Electronics Forum | Fri Mar 21 08:56:29 EST 2003 | russ
Is it possible that the flux you used, if applied in excess could have caused the balls to "blow out". I have seen this in the past and it was related to the type of flux we were using and the amount. Russ
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. Common defects and treatment methods of SMT reflow soldering: bridging Bridging can be said to be one of the most common defects. If a bridge defect occurs, it may cause a short circuit between device components
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. Therefore if you are building class 3 product, you have a dilemma as initiating this requirement may cause manufacturing problems with component coplanarity
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