New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
The inspection of welded tanks is a time-costly procedure. Modern real-time DR-systems result in a huge efficiency gain in comparison to the conventional film (RT) approach. VisiConsult developed a cutting edge custom system with weld tracking, defec
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Thu Nov 13 09:14:52 EST 2008 | raiders
Hi All, We encounter capacitor crack in the ICT, it contributes 2% of the failure. We are not sure whether these crack coming from the SMT. All these crack having the same pattern. Please refer to attached file. Anybody encounter the same thing befo
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Technical Library | 2008-10-23 15:36:58.0
As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks.
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
