Industry Directory | Manufacturer
Huntron is a supplier of tools for engineers and technicians who test, diagnose and troubleshoot printed circuit assemblies. Our popular products are Huntron Tracker and test automation platforms such as the Access Robotic Prober.
Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Wed Jan 26 21:23:51 EST 2000 | Dennis
Hello! all Will anybody give me advice for missing componets for 0402, 0603 R or C chips? I am not gonna tell you which machine I use, but from my experience, every p&p machine has possibility for missing component after placing 400 or more componen
Electronics Forum | Sat Dec 13 08:03:46 EST 2003 | Stefan Witte
The only part, which could cause component misplacement on the rotary heads of the Siplace machine is the vacuum valve. I don�t know the official name in the part catalog, but I use to name it plunger. The plunger is moved in and out by a miniature s
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace HS60 Pick And Place Machine Vintage: Year 2006 PCB Direction: Left to Right Heads: Condition: Refurbished, working Running Hours: Series Number: Feeders: Missing Parts: No Warranty: 6 Months after instllation Location: China Lead time: 7
Industry News | 2003-06-26 08:12:04.0
He replaces Robert J. Schutz
Industry News | 2003-05-29 08:40:51.0
Withdrawal of Nam Tai's registration statement filed on Form F-3 for a proposed offering of 3,000,000 common shares of the company
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2024-04-29 21:39:52.0
In this paper, we develop and put into practice an Automatic Optical Inspection (AOI) system based on machine vision to check the holes on a printed circuit board (PCB). We incorporate the hardware and software. For the hardware part, we combine a PC, the three-axis positioning system, a lighting device and CCD cameras. For the software part, we utilize image registration, image segmentation, drill numbering, drill contrast, and defect displays to achieve this system. Results indicated that an accuracy of 5µm could be achieved in errors of the PCB holes allowing comparisons to be made. This is significant in inspecting the missing, the multi-hole and the incorrect location of the holes. However, previous work only focusses on one or other feature of the holes. Our research is able to assess multiple features: missing holes, incorrectly located holes and excessive holes. Equally, our results could be displayed as a bar chart and target plot. This has not been achieved before. These displays help users analyze the causes of errors and immediately correct the problems. Additionally, this AOI system is valuable for checking a large number of holes and finding out the defective ones on a PCB. Meanwhile, we apply a 0.1mm image resolution which is better than others used in industry. We set a detecting standard based on 2mm diameter of circles to diagnose the quality of the holes within 10 seconds.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Career Center | Baguio City, Philippines Philippines | Engineering
Responsible to effectively utilize all of the available resources such as machines, materials, manpower and methods in order meet the Offsite metric goal according to the customers’ specifications, requirements and needs; Responsible for evalua
| https://unisoft-cim.com/support/dni-components.html
) . Definition of Do Not Install (DNI) components: Do Not Install (DNI) are components the have reference designator locations on the PCB assembly but are not being inserted on a certain revision of a PCB assembly build
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/060717-how-dispensing-components-work-together-to-reduce-costs
. Nordson EFD also certifies that no silicone mold-release agents, which can cause fluid contamination, are used in the precision molding process or at any other time during the production of our dispensing components
