Electronics Forum | Wed Sep 05 14:53:45 EDT 2001 | Jeff Meier
We have customers that are requiring no flux residue left on boards after soldering of non-water washable parts. We currently use Multicore Crystal 502 No-Clean to solder parts that are not washable. Has anyone come up with a good way to remove this
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2022-10-06 18:52:04.0
KYZEN will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Wednesday, October 19, 2022 at the Marriott Melville in Melville, NY. The KYZEN team will discuss how its AQUANOX® A4639, CYBERSOLV 141-X and MICRONOX MX2501 can solve individual cleaning challenges.
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
? After SMT machine soldering, there will be some voids in the solder joints. These inevitable voids will cause some potential risks to the quality of the whole product, and the most direct manifestation is that the life of the product will be far less than expected
Heller Industries Inc. | https://hellerindustries.com/formic-reflow/
. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Our Formic Reflow Process . These formic reflow ovens operate like a normal reflow oven with the addition of formic acid vapor injection into key thermal zones
