- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
Electronics Forum | Wed Feb 26 21:44:52 EST 2003 | Paul Dansereau
I will be building a board, about 8 X 12 , .062" thick using a standard FR406 stackup. It has a variety of devices, including CCBGA , CBGA and PBGA's. Given the challenge of developing a reflow profile that will accomodate both ceramic and plastic BG
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
