Industry Directory | Manufacturer
I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.
Batteries for laptop computers, cell phones, camcorders, cordless phones, digital cameras and UPS systems.
PCB Separator machine For electronics, cell phones, computers, PCB, FPC PCB separate 1.PCB Protection 2.Calibration Blade Setting 3.All Speed Control By Human 4.More Accurating Specification: Model CWV-1M
Automobile mechanical parts coating , cell phone buttons point glue , mobile phone battery packaging,laptop battery packaging , the coil point glue , PCB bonding / sealing , IC bonding / sealing , horn external punctuate glue , PDA sealing , LCD
Electronics Forum | Thu Sep 23 23:51:49 EDT 2004 | Chics
Hii, Can anyone give some info on how to assemble a gsm cell phone, machinery, methods, techniques used.... and what sort of inspection techniques and equipments are used and what are the costs associated with it Please reply.
Electronics Forum | Thu Feb 13 12:45:03 EST 2003 | Claude_Couture
No cell phones on the floor under penalty of suspension or worse. They are allowed emergency phone calls as many of the women in production have kids in day-care or school. But the dept. supervisor is the one answering the phone and decides to take a
Used SMT Equipment | AOI / Automated Optical Inspection
- 8 CAMERAS(5 MEGA PIXEL CAMERA) • High performance inspection for 01005 components • New 5.0 megapixel CMOS color cameras • 17 micron camera resolution • Dual-core dual-processor computer • Line-speed inspection for demanding cell phone and
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
.jpg)
Parts & Supplies | Pick and Place/Feeders
JUKI 40031160 NEW SAFETY RELAY ASM (GX3C) JUKI 40031161 MONITOR BRACKET ASM JUKI 40031183 FILTER BRACKET JUKI 40031184 FILTER COVER U JUKI 40031185 FILTER COVER B JUKI 40031236 GS BRACKET AN JUKI 40031237 GS BRACKET BN JUKI 40031355 CAL
.jpg)
Parts & Supplies | Pick and Place/Feeders
JUKI 40031355 CAL PIECE V2 ASM JUKI 40031400 SDD 128MB JUKI 40031401 DOS FORMAT SDD 128MB JUKI 40031410 BARE JIG PLATE B JUKI 40031411 BARE ADJUSTMENT JIG JUKI 40031620 LOAD CELL ASM HLC-5N JUKI 40031754 I-CX PCB JUKI 40031812 LINEAR SC
Technical Library | 2010-10-07 20:20:58.0
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin
Technical Library | 2012-11-08 19:16:39.0
first published in the 2012 IPC APEX EXPO technical conference proceedings. Twenty-nine different cells phones have been disassembled, ground up, dissolved and analyzed for elemental content, mainly for information about the metals present in the phones, but also for some metalloids and non-metals. The paper will discuss the method used and propose possible sources in the telephones for certain elements of interest and the reasons for the interest in some of the elements.
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Tue Jun 11 00:00:00 EDT 2024 | Uniontown, Ohio USA
7th Annual Ohio Valley Chapter Member Appreciation Golf Outing
Events Calendar | Tue Sep 10 00:00:00 EDT 2019 - Thu Sep 12 00:00:00 EDT 2019 | Novi, Michigan USA
Battery Show
Career Center | , Illinois USA | Sales/Marketing
We are looking for a New Business Development Sales Engr to develop new accounts in the Midwest. Experience selling equipment to PCBA and PCB manufacturers in the Midwest. 60-70k base + commission. 100k at plan. Work out of your home. Company car,
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/powder-coating-booths/lean-cell-fast-color-change-powder-coating-system
Lean Cell® Fast Color Change Powder Coating System Industrial Coating Systems Corporate | Global Directory | Languages Division Only All of Nordson Application Solutions Powder Coating Liquid Painting Container Coating Sealant Adhesive Systems Automotive Assembly UV Curing Systems Industries Aerospace Agriculture
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Speaker%20Agreement%20Form.pdf
Follow the SMTA Technical Paper and Presentation Format Requirements and submit for review By deadline of May 15 First Name: Last Name: Company: Position: Full Address: Phone: Ext: Cell phone if you prefer text message correspondence Paper/Poster Title
