Industry Directory | Manufacturer
We are specialized in chip ceramic & tantalum capacitors, mylar capacitor, electrolytic capacitor, rectifier, semiconductors, LED, IC, etc.
Subjected as one of the high-tech enterprises which specialized in the development, production and sales of high voltage capacitors, wide capacitance capacitors, high temperature capacitors.
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
Used SMT Equipment | General Purpose Test & Measurement
The Agilent 4288A 1kHz/1MHz capacitance meter offers a high-speed with reliable measurements for capacitor testing in the production lines. The measurement capabilities of capacitance from low to middle values (up to 20uF) can be realized with accura
Used SMT Equipment | THT Equipment
2010 Panasonic Panasert RL-131 Radial Lead Inserter NM-EJR1A 0.17 sec/component Resistor, Electrolytic - Ceramic capacitor, LED, Transistor, Filter, Resistor network APPLICABLE COMPONENTS 40 Component Inputs 200-400v,3phase, 50/60
Industry News | 2003-03-26 08:43:33.0
Dr. Jeffrey Graves has been named President and Chief Executive Officer, effective immediately.
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
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Characterizing Electronic Components
Career Center | Greenville, South Carolina USA | Engineering,Management
This is a retained executive search for our client who is one of the largest manufacturers of solid tantalum, and multi-layer ceramic capacitors manufactured in many sizes & configurations and sold to a variety of OEMs in a broad range of industries.
Career Center | Sto. Tomas, Batangas, Philippines | Engineering
SKILLS & EXPERIENCES A.Materials engineering and management 1.Handles matters about materials -Ceramic and laminate substrates & Surface Mount Devices (SMDs) i.e. chip capacitors and resistors -Perishable materials i.e. solder paste (including Pb-fr
Career Center | , Puerto Rico USA | Engineering,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support
Thanks for taking a few minutes out of your busy schedule. I am interested in the electronics and computers since my five years of age ( in the late 60's) when I disarmed all the electronic toys that arrived at my hands and played with that funny thi
SMTnet Express, January 25, 2024, Subscribers: 25,319, Companies: 12,002, Users: 28,668 █ Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step
SMTnet Express, February 29, 2024, Subscribers: 25,362, Companies: 12,025, Users: 28,728 █ Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step
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Component Cracking-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Component Cracking Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow
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: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing