Industry Directory: ceramic lid (2)

Kyocera America, Inc.

Industry Directory | Manufacturer

Ceramic and organic packaging and package assembly. Flip Chip, Wirebond, Lidding for a wide range of devices and applications from power semiconductors, ASICs, to complex modules.

West-Tech Materials

Industry Directory | Manufacturer's Representative

Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi

New SMT Equipment: ceramic lid (5)

HTCC QFN Packages

HTCC QFN Packages

New Equipment | Components

HTCC QFN Packages to 40GHz High Temperature Co-Fired Ceramic (HTCC) QFN packages from Barry Industries feature low-loss broadband transitions for superior performance over frequency. HTCC construction provides for enhanced mechanical strength and h

Barry Industries, Inc.

GE BENTLY NEVADA 330103-00-10-10-02-05 PROBE

GE BENTLY NEVADA 330103-00-10-10-02-05 PROBE

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: ceramic lid (11)

lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund

We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material

Industry News: ceramic lid (5)

StratEdge Semiconductor Packages Now Sold on Amazon.com

Industry News | 2017-05-03 21:11:11.0

StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages.

StratEdge Corporation

Verifer HR High-Resolution X-Ray Inspection Solution

Industry News | 2004-09-27 17:12:27.0

High-Resolution X-Ray Inspection Under $60K

MatriX Technologies GmbH

Parts & Supplies: ceramic lid (2)

Siemens PARTS AND FEEDERS SELL BIG STOCK

Parts & Supplies | Pick and Place/Feeders

we have siemens/ASM spare part feeders Big QTY NEW AND USED in stock.if you are interesting any,pls free contact  us   nbwqs@vip.163.com 321617 AXIS TURRET 321617 AXIS TURRET 321617 AXIS TURRET 326142 COMMUNICATION BOARD F. SIPLACE S20 3261

KD Electronics Ltd.

Siemens SIEMENS SPARE PARTS

Parts & Supplies | Pick and Place/Feeders

we are big siemens/ASM spare part selling in sotck. if you are any interesting,pls fre contact us 00141099 Tape feeder module 3x8mm S-feeder exclusively for 0201/0402 00141098 Feeder 3x8mm S 00141088 SL feeder 00117010 Dip module f.  fluxes an

KD Electronics Ltd.

Express Newsletter: ceramic lid (47)

Partner Websites: ceramic lid (24)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU “die to lid/heat spreader” (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses

Heller Industries Inc.

Packing Instructions for DS Series Dispense System

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Packing-Instructions-DS-Series-Dispenser-22290017.pdf

” D - size may vary according to conveyor length and presence of optional hardware. • Wooden crate walls and lid plus 4”x4” supports under pallet

GPD Global


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