A division of Palomar Technologies, MicroJoin designs and manufactures systems for ACF & Heat Seal Bonding, Reflow Solding with Patented Ceramic Hot Bar Technology, Equipment for Resistance Micro-Welding & TIG Welding for High Precision Metal Joining
Industry Directory | Manufacturer's Representative
Manufacturer's Representatives serving the SMT/PCB manufacturing companies in New England
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
R&D Technical Services offers a full line of Single Vapor Reflow Systems. The RD10 provides consistent, uniform and reliable heat transfer in a Belted Inline application for high quality reflow, curing and drying. The RD10 utilizes user friendly cont
Electronics Forum | Thu Feb 22 12:10:20 EST 2007 | jsmith01
Does anyone know of a supplier of ceramic reflow Thermodes for a Microjoin 4200 hot bar machine? Microjoin was acquired by Miyachi Unitek and they of course do not support this machine any more.
Electronics Forum | Fri Jun 20 10:27:19 EDT 2003 | Cristiano Dick Smiderle
Hi We are experiencing serious problem with ceramic capacitors. They are with low electrical resistence and the problem is intermittent. We found some of them with micro cracks but not all. What could be the causes for this problem? We are su
Used SMT Equipment | Pick and Place/Feeders
Occasion Optimat 1998 in excellent condition 20x 8mm feeder 4x 12mm feeder 1x 16mm feeder 1x Tray feeder units 1x ic feeder with several stick feeder adapters placer is a flexible computer controlled machine for automatic placement of SMT com
Used SMT Equipment | Pick and Place/Feeders
20x 8mm feeder 4x 12mm feeder 1x 16mm feeder 1x Tray feeder units 1x ic feeder with several stick feeder adapters placer is a flexible computer controlled machine for automatic placement of SMT components on to PCB?s or ceramic substrates using
Industry News | 2011-05-16 16:53:28.0
SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.
Industry News | 2016-04-20 10:27:40.0
BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
ETA SMT Desktop PCBA Router ETA-100A If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB separator,PCB depane
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
SMTnet Express, January 22, 2015, Subscribers: 22,251, Members: Companies: 14,183, Users: 37,571 High Temperature Ceramic Capacitors for Deep Well Applications. R. Phillips, J. Bultitude, A. Gurav, K. Park, S. Murillo, P. Flores, M. Laps - KEMET
Heller Industries Inc. | https://hellerindustries.com/parts/4643/
4643 - Ceramic High Temp Thermostat Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
