Applied Ceramics is a fabricator of custom-made ceramics, quartz, silicon and sapphire spare parts designed for the semiconductor industry.
Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
Electronics Forum | Tue May 25 12:43:00 EDT 2010 | jmedernach
I don't have experience with 1B73. I do have a ton of experience with CE-1155. There are a couple of gotchas with this material. First and foremost is that it HATES silicone residue. If the material is not sticking to parts and they aren't cerami
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Used SMT Equipment | Semiconductor & Solar
· Dual Magnification, auto-focusing Optical System · DC brushless, 60,000 RPM closed-loop speed-controlled Air Bearing Spindle · Front loaded dual Cassette Compartment · Inspection Drawer - also used for single wafer load/unload · Dress Wafe
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
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Parts & Supplies | SMT Equipment
J90831069C CP1_TB1_MC1_CABLE_ASSY J90831071C MC1_PS3_PS4_CABLE_ASSY SM33-PW009 J90831082C PS1_1_DC_POWER_BD_CABLE_ASSY J90831083D PS1_2_DC_POWER_BD_CABLE_ASSY J90831085B FZ1-FZ6_DC24V_POWER_CABLE_ASSY SM33-PW02 J90831086A RZ1-RZ6_DC24V_POWER_CAB
Parts & Supplies | Pick and Place/Feeders
Samsung SM320 vacuum generator J6707018A Other Samsung parts: J1301639 HINGE [E6-10-301-10] J7252088A SPACER[J7252088A] J9060102B NEW FIDUCIAL OUTER LED BOARD ASS'Y J9060141A NEW FIDUCIAL INNEW LED BOARD ASS'Y J7000787 TAPE GUIDE ASS&#
Technical Library | 2023-07-04 17:31:22.0
Conformal Coatings are polymeric materials used to protect circuitry, parts, and related components. They are most commonly used to protect printed circuit boards (PCBs) and electronic devices. However, conformal coatings can be applied to a wide variety of materials, including metal, plastic, silicone, ceramics, glass, and even paper. We use the term "substrate" to refer to an object or material that's been coated with a conformal coating.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Events Calendar | Wed Dec 04 00:00:00 EST 2019 - Wed Dec 04 00:00:00 EST 2019 | San Jose, California USA
SMTA Silicon Valley Expo & Tech Forum
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page A New Light-Weight Electronic Packaging Technology Based On Spray-Formed Silicon-Aluminiumby David M. Jacobson
| https://www.smtfactory.com/LED-Flip-Chip-id3680601.html
: 0 Author:Site Editor Publish Time: 2021-01-15 Origin: Site Industry Introduction LED flip chip refers to the chip that can be directly bonded with ceramic substrate without welding wire. We call it DA chip
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
. Yet despite these setbacks, rigid PCBS are durable, cost-effective, and powerful. Rigid printed circuit boards are generally ceramic-based substrates
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