Applied Ceramics is a fabricator of custom-made ceramics, quartz, silicon and sapphire spare parts designed for the semiconductor industry.
Industry Directory | Manufacturer
OCTO, powered by CERcuits, provides ceramic PCB & substrates to the electronics industry. We develop and manufacture alumina PCB, aluminum nitride PCB, heat plates and other substrates. Get quotes & order online at our OCTO portal
Model name: NPM-W Substrate size Monorail * 1 Overall installation: L50mm×W50mm ~ L750mm×W550mm 2 positions: L50mm×W50mm ~ L350mm×W550mm Dual-track * 1 Monorail transmission: L50mm×W50mm ~ L750mm×
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Wed Aug 22 21:00:41 EDT 2001 | dlkearns1
Yes, it is very true and very clean SNAP!
Electronics Forum | Mon Aug 27 10:09:50 EDT 2001 | gresko
Steve, Depending on the type of equipment you are using for P&P you may want to consider placing and processing the substrates in Auer boats. I have provided many applications for ceramic substarate users using purchased Auer boats or machined palle
Used SMT Equipment | SMT Equipment
JUKI KE2050 SMT 13,200CPH: Chip (laser identification / actual production efficiency), laser stickers titles x 1 (4 nozzle), 0603 (Imperial 0201) chip to 20mm square element, or 26.5 * 11mm. 0402 (Imperial 01005) chip factory option specifications:
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Parts & Supplies | Other Equipment
FUJI Nozzle List Brand Machine Model Specification Material of nozzle tip FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 Tungsten steel FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 Tungsten steel FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 /
Parts & Supplies | SMT Equipment
Model: FUJI Nozzle FUJI Nozzle List Brand Machine Model Specification Material of nozzle tip FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 Tungsten steel FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 Tungsten steel FUJI CP6 / CP7 Bore diame
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Woodbury, Minnesota USA | Management,Production
Over 20 yrs experience in SMT. Worked with medical, industrial, communications, aerospace and automotive electronics. Have experience working in ITAR controlled companies.
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
. Yet despite these setbacks, rigid PCBS are durable, cost-effective, and powerful. Rigid printed circuit boards are generally ceramic-based substrates
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
) Direct Bond Copper Defects - Application Note 1066 Sample & Method This rectifier has three ceramic substrates solder bonded to a copper base
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