Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.
New Equipment | Rework & Repair Equipment
A lot of machine for an affordable price! The Model WDS-650 BGA Rework System has an 8mp High Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs. A great mid level system wit
New Equipment | Rework & Repair Equipment
The Model WDS-900 is a top-of-the-line Nitrogen Capable BGA Rework System with a High-Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs. An excellent BGA Rework Machine or f
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Mon Oct 24 01:47:36 EDT 2005 | hcl
We are considering MY-9 AND YAMAHA YV 100XG. WHETHER YV100XG CAN PLACE O201 AND 01005? WHAT IS THE CAPABILITIES OF PLACEING BGA/CSP ETC.,
Used SMT Equipment | Repair/Rework
2008 Hakko FR1418-03 BGA Rework Station Date of Manufacture: 2008 120 VAC , 15A IR Preheater Top Heater 14" x 20" Max Board Size Able to handle: BGA, CGA, QFP, LCC, TSOP and more Windows OS Gantry Style System Condition: Complete & Oper
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Parts & Supplies | Pick and Place/Feeders
Panasonic nozzles available for MSF/MCF/HDP/HD/CM/DT Series MSF Series Nozzles Part Number Description PAMSFSSD Nozzle, SS (Diamond Tip) 1045 9080 04 Nozzle Tip Only, SS (Diamond Tip) PAMSFSD Nozzle, S (Diamond Tip) 1045 9080 14 Nozzle Ti
Parts & Supplies | SMT Equipment
MV MV2 MV2C MV2F MV2VB Series Nozzles Part Number Description 1020 1750 15XX Nozzle, RSS(S), #1 (Shinny Tappered Tip) 1020 1530 00 Nozzle, M-1.2, #2 1020 1795 61xx Nozzle, M-1.6, #2 1020 1795 00xx Nozzle, L, #3 1020 1750 11xx
Technical Library | 2018-04-27 12:59:29.0
Hot Air and IR are the two main types of rework stations used by OEMs and PCB contract manufacturers today. Both have advantages and disadvantages and choosing the right one for your application requires a careful consideration of a number of factors, including your budget, your working requirements and the capabilities of your staff. In this article, we outline some of the differences between hot air and IR BGA rework stations.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
The biggest, baddest, most affordable Nitrogen Capable BGA Rework Station demonstrated by Dennis O'Donnell the BGA Expert! Safe, precision rework for SMD, BGA, and LED chips on boards as large as 36" or more!. The versatile E6250U rework station co
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
BGA Rework Training and Certification – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
Imagineering, Inc. | https://www.pcbnet.com/blog/pros-and-cons-of-full-turnkey-vs-consignment-pcb-assembly/
Pros and Cons of Full Turnkey vs. Consignment PCB Assembly Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI
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