Industry Directory | Manufacturer
MetroSpec Technology is a manufacturer of High Performance LED light circuits for Light Fixture Manufacturers.
New Equipment | Board Handling - Conveyors
Model No: KSUN 250 Automatic Sucking Loader PCB loading time: Approx 6seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 30L/minute Transport height:
New Equipment | Board Handling - Conveyors
Model No: KS330 Automatic Sucking Loader PCB loading time: Approx 6seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 30L/minute Transport height: 900
Electronics Forum | Mon Jul 17 05:19:51 EDT 2017 | esolano
Hi All. We have bought EKRA E4 screenprinter. We are running L to R and printer has R to L direction. Does anyone can help me, how to change this ? My id is atulpant@tekmart.com Thanks & Best Regards Atul
Electronics Forum | Thu Aug 24 23:25:42 EDT 2017 | micropak
I have an E5 and I believe this is in service mode /machine configuration.
Used SMT Equipment | Pick and Place/Feeders
Detailed Product Description 1. The acquisition for the rectangular coordinate of X-Y direction. 2. Check for the existence, transformation, user in the feeder 3. The installation is to euip it with actual device and consolidation in feeder base
Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Industry News | 2003-06-03 08:31:41.0
The main reasons for the change are slower economic development in China due to the SARS epidemic and the weakening of the US dollar.
Industry News | 2003-04-07 10:25:38.0
Customers Commend Teradyne's Assembly Test and Connection Systems Divisions
Technical Library | 2007-11-29 17:20:31.0
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
PCB 90°turning conveyor and PCB turn diverter/PCB conveyor machine link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/95.html PCB 90°Turn conveyor is designed for changing the conveying direction of flow of a PCB production li
PCB 90°turning conveyor and PCB turn diverter/PCB conveyor machine link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/95.html PCB 90°Turn conveyor is designed for changing the conveying direction of flow of a PCB production li
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Rosemont, Illinois USA | Management,Production,Quality Control,Research and Development
For Philips, improving lives with light goes back to our founding fathers in 1891. At Philips Lighting, we carry this tradition forward, across all three domains: Healthcare, Lifestyle and Technology. Through a huge array of products, and variety in
Career Center | Alleppey, Kerala India | Engineering,Production,Quality Control
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
Career Center | , | 2014-01-31 02:17:45.0
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About FREE Company Listing! Lead-Free Capability Auditing a Contract Manufacture Bob Willis As industry changes to meet the deadline
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/blog/news-1/2021-new-start-2
! Looking back at 2020, the years are rushing and forget the passage of time. Persevere in the goal, do not change the direction of progress
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_user-preferences-problem_topic1775.xml
... , so it does change the pad environment level but it is not respecting our user settings. Would you please help us fix this problem, or if we are doing something wrong please point us in the correct direction.