Electronics Forum: change temperature from solder paste to curin (5)

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly

Solder paste to room temperature.

Electronics Forum | Tue Apr 19 09:09:28 EDT 2005 | russ

Here is one reason- It eliminates the viscosity change during printing operation from the paste warming up and getting thinner. I would contact your paste supplier and have them give you the full list.

Industry News: change temperature from solder paste to curin (23)

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

The SMTA Capital Chapter to Host a Meeting on November 7th at ZESTRON Americas

Industry News | 2017-10-05 05:56:21.0

The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.

Surface Mount Technology Association (SMTA)

Events Calendar: change temperature from solder paste to curin (1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Express Newsletter: change temperature from solder paste to curin (1136)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

SMT Express, Volume 4, Issue No. 1 - from SMTnet.com

INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured

Partner Websites: change temperature from solder paste to curin (469)

Solder recycling machine and solder dross separator operation-PCB magazine loader,PCB turn conveyor,

ASCEN Technology | https://www.ascen.ltd/optical_inspection/1048.html

Solder recycling machine and solder dross separator operation-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN

ASCEN Technology

Solder Pot Maintenance and Dross Removal | EPTAC

| https://www.eptac.com/soldertips/solder-pot-maintenance-and-dross-removal/

: The article from AIM Solder is one of many regarding how solder bars are made and the type of elemental materials used to create them


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