Electronics Forum | Thu May 18 16:27:53 EDT 2006 | bman
I don't have any experinence with this, but my concern is that you are limiting the amount of contamination your pot can absorb before you ever run a board through. What I mean is that even if you are able to drain all but about a kg of the old sold
Electronics Forum | Thu May 18 14:50:08 EDT 2006 | grantp
Hi, The bath is titanium coated, and the machine is only 2 years old, and was designed for lead free, so we know we don't need to change anything. The reason the supplier gave for suggesting the bath change is "other companies are doing it" and it'
Used SMT Equipment | Soldering - Selective
Juki Cube 460 Selective Solder system Don't miss out on this opportunity to own this Excellent Selective Soldering Machine the Juki CUBE-460 Year 2022 ! The Juki Cube 460 is the most accessible selective solder that allows for easy setup & easy maint
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2009-04-08 15:42:01.0
WATERTOWN, MA - April 2009 � Devoted to the development of new radiation detector and systems technology, RMD Instruments LLC announces that it will premier a new solder analysis and identification feature of its innovative LeadTracer-RoHS XRF system in booth 1042 at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
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Testing to Eliminate Reliability Defects from Electronic Packages News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Testing to Eliminate Reliability Defects
| https://www.eptac.com/solder-tips/
Solder Pot Maintenance and Dross Removal Question: We found an article online about solder pot maintenance and the removal of dross, specifically there is an interest to us in the “changing bar solder” Section
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution
