STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Other
ISO 9001: 2000 Franchised Distr. of Capacitors, Resistors, Semiconductors, SMD, Connectors, Crystals, Diodes, Fuses, ICs, Lamps, LEDs, Potentiometers, Relays, Switches, Transistors, Specializes in Hard to find/Obsolete Parts
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
Electronics Forum | Thu Aug 21 08:15:07 EDT 2008 | naynayno
Thanks Dave, I will be sticking with Manufacturing Engineering. These are good guidelines but what is standard clearance for various packages? This is a dimension we usually seek by eye, whether we will have a problem or not. We use straight DI -
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Used SMT Equipment | SMD Placement Machines
* Windows NT * Super fine head * Line Array camera * Pneumatic Tape Feeder * Locate pin * Edge Clamp System * Z servo push up plate * Entrance sub stopper * Exit sub stopper * Auto width adjust * Hi
Used SMT Equipment | SMD Placement Machines
* Windows NT * Flying Nozzle change head * Line array camera * Pneumatic Tape feeder * Main Stopper * Locate Pin * Edge Clamp system * Z servo push up plate * Entrance sub stopper * Exit sub stopper *
Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Parts & Supplies | Pick and Place/Feeders
JUKI HN00149000A CLAMP FILTER Other juki parts: HN000520000 BEADS ZBF503D-00 HN000760000 CHALK COIL SN-8D-500 HN00089000A NOISE FILTER 20A HN001430000 BEADS HN001490000 CLAMP FILTER(L) HN00149000A CLAMP FILTER HN00167000A SURGE ABSORBER HN00
Parts & Supplies | Pick and Place/Feeders
square chip resistor 1608. 2012. 3216. 3225 (5025.6432 net work resistor (excluding SOP, SOJ, PLCC types) MELF resistor 1.6*1.0. 2.0*1.25 3.5*1.4. 5.9*2.2 Laminated ceramic capacitor 1608, 2012, 3216, 3225, 4532, 5750, (
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Middleboro, Massachusetts USA | Production
Highly motivated SMT Repair/ Assembly Operators needed for Contract Electronics Manufacturer. Duties include: repair and soldering of SMT and TH components, assembling of PCB's, and operation of automated production equipment. Experience using vario
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Lewis & Clark | https://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/
OK International/ Metcal APR-5000 Array Package Rework Station - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
| https://www.smtfactory.com/How-to-replace-the-chip-capacitor-of-the-SAMSUNG-Pick-Place-Machine-id3532139.html
& Place Machine 's chip capacitor identification rules are partly similar to chip resistors. The difference is that the surface of the chip resistor will have parameter identification, but the surface of the chip capacitor does not have any parameter identification
