The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Electronics Forum | Thu Apr 22 12:46:41 EDT 2004 | Mark
What type of chip bonder you use? I use Loctite 3611... part #25410 on my stencil screening and use epoxy cleaner, air hose and that takes care of our issues. If you use alchol it just hardens the epoxy so make sure its cleaned out good before restor
Electronics Forum | Wed Sep 30 15:06:07 EDT 1998 | Chrys
I didn't use my real name because I don't want to get bombed with phone calls and emails. We are an OEM looking to put in a SMT line soon. Is this GSM a decent machine? How much does it cost? | | Also and info on decent screen printers and re
Used SMT Equipment | Pick and Place/Feeders
FUJI High Speed Mounter NXT IIIC Contact me if interested!! Features The best floorspace productivity in the industry One NXT IIIc module occupies just 0.46 m² of floorspace, making it an incredibly compact machine.Retaining all the advanced feat
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Parts & Supplies | Chipshooters / Chip Mounters
SMT Mechanical feeder calibrator for JUKI placement equipment , FF CF AF type feeders product name:JUKI SMT FEEDER calibration jigs Dimensions:L500*W350*H500(MM) Correction model:pneumatic Product parameters Power supply: 220V The number of fe
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Parts & Supplies | Chipshooters / Chip Mounters
N510067153AA N510012402AA SMT Panasonic Bonder BM Head Solenoid Valve Original Brand New KXF0DKDAA00 KXF0DKCAA00 KXF0DKFAA00 KXF0DKEAA00 KXF0DKGAA00 N510004586AA N510023795AA KXF0DGKAA00/CS8420i-20, KXF0DZJ2A00 N610001944AB N610001943AB/ N61
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
Technical Library | 2012-12-26 20:18:50.0
①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.
Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
(two unlike materials). In capillary underfill applications, a precise volume of underfill material is dispensed along the side of a chip or package to flow underneath through capillary action, filling air gaps around
| http://etasmt.com/te_news_bulletin/2013-03-05/2761.chtml
. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap
