Electronics Forum | Thu Feb 03 12:21:15 EST 2005 | Chunks
Lets get to the simple things. Wave or Reflow? Wave soldered parts have a higher susceptibility to physical damage until they are waved. That�s were I normally see this type of break. Usually, the crack is a circular pattern in the cap if it�s fr
Electronics Forum | Thu Mar 26 11:25:21 EST 1998 | Earl Moon
In December and January (1997 & 1998) a number of people requested information regarding component cracking. I overlooked this until recently thinking design and process requirements were violated. After reviewing the last 14 months consulting effort
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Parts & Supplies | SMT Equipment
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Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E9608717000 LASER SENSOR HEAD JUKI SPARE PARTS MODEL LIST JUKI
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Technical Library | 2019-08-15 13:31:52.0
Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error.
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=16
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
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