Industry Directory | Consultant / Service Provider / Manufacturer
Tape Splicer for splicing SMD Carrier Tapes, including Paper and Pocket Tapes. SMD Splicing Tapes for 8mm - 24mm carrier tapes. Adhesive Back Die Carrier Tapes for Bare Dies and Flip Chips. SMT Carrier Tape Feeders.
Industry Directory | Manufacturer
Manufacturers flexible printed circuits, circuit materials, IC packaging substrates, laminates, conductive coatings and tapes
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Electronics Forum | Fri Aug 04 05:10:57 EDT 2000 | Dougie
Hi, We use a mixture of plastic tape carriers and paper tape carriers for placing chip components. We are experiencing a problem which I know is a problem across the industry...when using the plastic carriers, the chip components stick to the tape c
Electronics Forum | Tue Jun 10 17:13:44 EDT 2014 | grauen06
I have seen this on a MyDATA machine and we had to slow our feed rate of the feeder down. That seemed to do the trick. We concluded the carrier tape was too large for the part, but our vendor didn't really seem to care.
Used SMT Equipment | Pick and Place/Feeders
Board size L50xW50mm – L460 xW410mm Board thickness 0.5mm-2.0mm Flow direction Left to right Conveyor speed Max. 420mm/sec, speed variable, soft stop fuction Placement speed A (NB1) 0.13 sec/CHIP, 0.38 sec/TSOP32 Placement speed B
Used SMT Equipment | Other Equipment
SMD Chip Counter CU2000B APPLICTION ï¼ By using the principle of photoelectric sensing, COU2000 Series SMT Chip Counter can take the advantage of the relations between the sprocket holes and the parts and count the SMD parts accurately and quickl
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2008-08-14 13:20:36.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Parts & Supplies | Chipshooters / Chip Mounters
155806 STEPPER MOTOR, REAR 155804 STEPPER MOTOR, FRONT 155786 SQY'S HOME LOOM BOM 145686 BEARING, ANGULAR CONTACT 140327 SOLID STATE PUSH BUTTON SWITCH 112545 DOWEL 3DIA X 12LG GRD 1 112414 CABLE
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Parts & Supplies | Chipshooters / Chip Mounters
700689 WASHER M5 BLACK PLASTIC 700404 SCREW M4X6 CSK.SLTD.M/C ST.ST 700402 SCREW M3X8 CSK.SLTD.M/C ST.ST 700401 SCREW M3X6 CSK.SLTD.M/C ST.ST 700313 SCREW M4X10 BUTT.HD ST.ST 700118 SCREW M5X25 CAP HD ST.ST 171299 CARRIER^CASSETTE
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2007-06-06 15:25:30.0
Though today's microvias and high aspect plated through holes (PTH's) look nothing like the earliest through holes of 40 years ago, the PTH in its various forms remains the “weak link” and most critical element of printed wiring boards and laminate chip carriers (...) The paper outlines an approach to evaluating PTH reliability and quality that involves characterizing PTH life across a range of temperatures to reveal intricacies not seen by testing at a single delta-T, and certainly difficult to predict by modeling alone.
L181E821000 OPERATION GUIDE COLLAR L182E021AB0 REAR MONITOR ASM L184E921000 SWITCH PANEL OP L185E021000 HOD ASSEMBLY L185E0210A0 HOD ASSEMBLY L186E521000 OP UD STOPPER L190E021000 CHIP BOX L190E0210A0 HARD DISK ASM(ST) E1403706A00 C
L181E821000 OPERATION GUIDE COLLAR L182E021AB0 REAR MONITOR ASM L184E921000 SWITCH PANEL OP L185E021000 HOD ASSEMBLY L185E0210A0 HOD ASSEMBLY L186E521000 OP UD STOPPER L190E021000 CHIP BOX L190E0210A0 HARD DISK ASM(ST) E1403706A00 C
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALLEGRO&PN=A6812EEP
: Plastic Leaded Chip Carrier (PLCC), 1.27 mm pitch; square, 7 pin X 7 pin, 11.51 mm L X 11.51 mm W X 4.57 mm H body Manufacturer: Part Number: Case Code: Datasheet: Footprint Name: Allegro Micro A6812EEP -T 28-Pin PLCC Download PDF - login required PLCC28P127_1245X1245X457L203X43 Footprint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations
- Application Note 1058 Acoustic image of a PLCC showing delaminations (red). Sample & Method This PLCC (Plastic Leaded Chip Carrier) was imaged through the top side at 15 MHz in the reflection mode
