501 chip die damage by heatsink results

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend

SMTnet Express - May 8, 2014

SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics

What You Must Know About Moisture Sensitive Devices (MSDs)

Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/

. The increase in temperature has led to more damage, and more botched yields. According to Assembly Mag , for every 10-degree increase in temperature, the MSL rating degrades by one level

Imagineering, Inc.

LED Assembly, Reliability & Testing Symposium

Surface Mount Technology Association (SMTA) | https://www.smta.org/LED/tech.cfm

., CALCE, University of Maryland 12:00 PM Lunch Session 3: LED Packaging 1:00 PM Solder Alloy Selection for LED Die Bonding and Package Assembly Nicholas Herrick, Alpha Assembly Solutions 1

Surface Mount Technology Association (SMTA)