ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 Our product can cut the board with the led chip no damage and no bend. After extensive tests of the separation process a lot of automobile suppliers use exclusively the depan
Electronics Forum | Mon Jan 18 18:08:38 EST 1999 | Jerry Stafford
I know there was some discussion a few months ago on this topic but I don't think a good solution was offered for checking CpK using chips using a chip shooter. I am looking for a way to measure this on our Fuji CP6-4000. Any suggestions? Jerry
Electronics Forum | Tue May 04 23:22:43 EDT 1999 | MTW
Please share your experience with Bulk Feeders for chip capacitors and resistors. What you like and what you don't like in the feeder? What features you think are missing? Please give the name of the manufacturer and any idea of cost.
Used SMT Equipment | Chipshooters / Chip Mounters
Dear all We have NPM -D3 for sale. Welcome to contact me if wanted. Thanks
Used SMT Equipment | Chipshooters / Chip Mounters
Dear all We have NPM -D3 for sale. Welcome to contact me if wanted. Thanks
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Parts & Supplies | Chipshooters / Chip Mounters
CM402 115 Panasonic CM402 Nozzle 115 Panasonic CM402 110 Nozzle Panasonic CM402 Nozzle 115 Panasonic CM402 Nozzle 115A Panasonic CM402 120 Nozzle Panasonic CM402 130 Nozzle Panasonic CM402 225C Nozzle Panasonic CM402
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA KW1-M1300-020 CL 8 2mm feeder for chip mounters 1000+pcs KW1-M1300-020 CL 8 2mm feeder for chip mounters YAMAHA Feeder SS 8mm P/N: KUJ-MC100-000 YAMAHA Feeder SS 12mm P/N: KUJ-MC200-000 YAMAHA Feeder SS 16mm P/N: KUJ-MC300-000 YAMAHA
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2013-08-14 14:06:48.0
This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.
Hanwha SCM1-DP SMT Feeder for Chip Mounter If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machin
Good Price Reflow Oven Soldering Machine ❙ Introduce of Reflow Soldering Oven High quality SMT reflow ovens, PCB soldering oven machine, lead-free reflow oven, for PCB soldering. ETA SMT machines manufacturers offers from 6-12 zones good pr
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Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0354-flip-chip
FLIP CHIP ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-for-chip-type-crystal_topic632_post2151.html
Footprint For Chip Type Crystal - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Footprint For Chip Type Crystal