Resistors specialist, Chip , Networks, Metal Film, Metal Oxide, Carbon Film, Fusible, Thermal, Cement , Power type, wirewounds.
Industry Directory | Manufacturer
Own design & production from DFB LD chip, passive components, modules and rackmount type in optic and data market.
New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88
I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.
Electronics Forum | Mon Jan 08 20:28:54 EST 2001 | Dave F
Consider the recommendations of J-STD-012 as the baseline for your efforts.
Used SMT Equipment | Pick and Place/Feeders
Model ：YCPII PCB size ：length 330 x width 250mm ~ length 50 x width 50mm *Includes automatic adjustment of PCB width Printing head group Double scraper head group (Selection of scraper material: metal or rubber) Printing speed: 2 ~ 200mm/
Used SMT Equipment | Labeling Systems
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
Industry News | 2003-05-19 09:16:12.0
Labtech will be exhibiting at the 2003 IEEE MTT-S Exhibition
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Parts & Supplies | SMT Equipment
JUKI Zevatech High Speed Chip Shooter FX3 Coupling 40046515 Metal White Description: 1. Part Name: Couping 2. Part Number: 40046515 3. Material: Metal 4. Color: White
Parts & Supplies | SMT Equipment
JUKI Zevatech High Speed Chip Shooter FX3 Coupling 40046515 Metal White Description: 1. Part Name: Couping 2. Part Number: 40046515 3. Material: Metal 4. Color: White
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Our QSA-30 Pick and Place machines are returned to like new condition by factory trained engineers. These systems are completely rebuilt to include new P4 computers, Hard Drives, Keyboards, Monitors, and a Trackball Mouse. The sheet metal covers are
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
SMTnet Express, December 4, 2014, Subscribers: 23,570, Members: Companies: 14,131, Users: 37,347 Metal-based Inkjet Inks for Printed Electronics Alexander Kamyshny, Shlomo Magdassi - Hebrew University of Jerusalem , Joachim Steinke - Imperial
SMTnet Express, August 1, 2014, Subscribers: 23019, Members: Companies: 13959, Users: 36568 Electrostatic Theory of Metal Whiskers. V. G. Karpov; Department of Physics and Astronomy, University of Toledo Metal whiskers often grow across leads
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