STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Electronics Forum | Wed Feb 06 07:02:31 EST 2019 | liquidspacie
We've found the problem. It was fault scale encoder. Swapping cards didn't help. Thanks everyone for the input.
Electronics Forum | Mon Jan 28 13:58:41 EST 2019 | oxygensmd
1. switch the axis cards 2. switch the axis servo cards 3. make sure the distance between scale and encoder is 400um 4. check the signal by oscilloscope, adjust to have the right signal 5. replace the scale or encoder
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Parts & Supplies | Chipshooters / Chip Mounters
Wanted working Power supply used on TIM 5100 machines. To be found on the lower left side of BEAM B. Its a multiblock power supply with 4 output slots. Slot 1 is 5VDC and Slot 2-4 is 24VDC. Looking for 1 or 2 of these. Please quote if you have such p
Parts & Supplies | Chipshooters / Chip Mounters
Wanted working Power supply used on TIM 5100 machines. To be found on the lower left side of BEAM B. Its a multiblock power supply with 4 output slots. Slot 1 is 5VDC and Slot 2-4 is 24VDC. Looking for 1 or 2 of these. Please quote if you have such p
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
| https://www.eptac.com/error-404-not-found/
Error 404 - Not Found - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more? Visit
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/40046972-stopper-chip-152019?page=189&order=name+desc
.40046972 /shop/40046972-stopper-chip-152019 ¥ 0.00 0.0 CNY ¥ 0.00 ¥ 0.00 This combination does not exist. ADD TO CART Inquiry Now
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