Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Thu Aug 28 02:51:01 EDT 2014 | padawanlinuxero
When you say "selecting correct value of the small chip components during assembly", you are referring to caps and resistors? and that you want to know that the correct cap or resistor was place in the correct location? your assembly is surface moun
Electronics Forum | Tue Aug 26 06:09:31 EDT 2014 | padmalathab
Is there any POKA YOKA tool for selecting correct value of the small chip components during assembly.
Used SMT Equipment | Chipshooters / Chip Mounters
2007 Universal 4983A "Advantis" SMT Pick & Place Dimensions: 67" x 68" x 66" Product Tree - 50204001 ALTA221 AC-30L Equipment No - 10091128 Electrical Diagram - 49958502 Features: o Lightning Head 30 Nozzles o O/S: Windows 2000 o S/W: SMUPS+Version
Used SMT Equipment | Pick and Place/Feeders
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Parts & Supplies | Assembly Accessories
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
Parts & Supplies | Circuit Board Assembly Products
Samsung original new CN/TN series nozzle Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | New Delhi, New Delhi India | Sales/Marketing
Equipment related to PCB Assembly ( wave soldering , Selective soldering , reflow , pick'n'place system , PCB Inspection system , PCB Rework System ,Flip - Chip Bonding system , Component forming system ). ---> Equipment relat
Career Center | Sta. Rosa, Philippines | Maintenance,Production,Technical Support
Complete knowledge in smt,aoi and reflow. 11 years working experienced in production and 5 years experienced in the field service job.
Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support
Experience SMT machine maintenance and SMT process from raw materials to finish goods
| https://www.feedersupplier.com/sale-13067829-hitachi-chip-mounter-hitachi-nozzle-ra05-smt-nozzles.html
Hitachi Chip Mounter Hitachi Nozzle RA05 SMT Nozzles Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://unisoft-cim.com/sample-library_feeder-and-nozzle-assignments-for-assembly-machines.html
software assembly documents feeder and nozzle assignments for assembly machines | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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