SMt BGA Rework and Repair Equipment including Split Vision processes and lead free soldered product rework application. Thru-Hole Desoldering and Plating Equipment.
Industry Directory | Manufacturer
Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Ha
New Equipment | Test Equipment
Hanwha SM481 Plus SMT Assembly Line Hanwha SM481 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:40000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
Electronics Forum | Fri Mar 28 15:08:37 EDT 2008 | jmelson
Hello, all, I have been having problems with bent push rods on my Philips CSM84. I have caught it a couple times when it happened, but it happens so fast I still don't know exactly what the sequence is that causes this. The push rod is clipping a
Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell
Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell
Used SMT Equipment | SMD Placement Machines
* Windows NT * Super fine head * Line Array camera * Pneumatic Tape Feeder * Locate pin * Edge Clamp System * Z servo push up plate * Entrance sub stopper * Exit sub stopper * Auto width adjust * Hi
Used SMT Equipment | SMD Placement Machines
* Windows NT * Flying Nozzle change head * Line array camera * Pneumatic Tape feeder * Main Stopper * Locate Pin * Edge Clamp system * Z servo push up plate * Entrance sub stopper * Exit sub stopper *
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2021-02-25 13:29:41.0
IPC commends President Biden for ordering a review of industrial supply chains critical to U.S. economic growth, innovation, and security.
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA KG7-M9166-00X PUSH IN CYLINDER FOR YV88II YV100II YV100A YV88A SMT MACHINE More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA KGC-M9179-A0X CYLINDER ASSY FOR YAMAHA YV180XG KOGANEI NDAS1030 CYLINDER KOGANEI NDAS10x30 Double Acting Pneumatic Air Cylinder NDAS10x30NDAS10*30 NDAS10X30 KOGANEI KGC-M9179-A0X CYLINDER ASSY.KOGANEI
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2011-10-06 13:59:04.0
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
IPC-J-STD-001 Chip Component Solder Joints - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login IPC-J-STD-001 Chip Component Solder Joints
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. Leadership in the Reflow Oven Marketplace I.C.T Industries continues to push the envelope of leadership in SMT technology. We provide solutions for electronics manufacturers and assemblers world wide
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