Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Winding machines for coils of all types, including relay, solenoid, RFID antenna, chip-core inductor, transformer, self-supporting and voice coil, etc. Single and multiple spindle winders, and automation systems.
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
New Equipment | Assembly Services
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Electronics Forum | Fri Apr 30 13:26:10 EDT 2021 | amaliahx
The pandemic has altered people's habits, causing a surge in demand for home electronic devices. This has swept the global chip supply and disrupted automobile manufacturing. The pandemic has led to the global shortage of semiconductors or chips, and
Electronics Forum | Fri Nov 07 11:32:36 EST 2003 | Gabriele
we experimented round pad for 0402, it improves chip self alignment and reduce tomb stone effects. On 0603, half round shape also gave guud results. G
Used SMT Equipment | Chipshooters / Chip Mounters
The NXTR A model includes an automatic feeder exchange system that frees operators from changeover and supply work, with additional features that strengthen the ability to maintain high-quality and productivity. Fuji is paving the way to the future o
Used SMT Equipment | Pick and Place/Feeders
1. Machine size: L: 1500mmW: 1607.5mm H: 1419.5mm (handling height: 900mm, excluding signal tower);2.Machine weight:Local machine: 1500kg,MFU-40: About 240kg (when fully loaded with W8 feeder),BTU-AII: About 120kg, BTU-B: About 15kg, MTU-AII: About 6
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2012-01-10 19:07:22.0
SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for IWLPC 2012 in San Jose, CA. John Ellis will detail the very possible threat of Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It's Coming..."
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Parts & Supplies | Chipshooters / Chip Mounters
PLUG (CABLE) 6 WAY TRIDENT 155761 GA FOR BREAKOUT BOARD 'E' (155534) 137462 4MM TEE CONNECTOR (SELF SEAL) 129024 DIN RAIL 125 LG 119543 EXTENDED LOCKING POST " 119466 115774 112664" SPACER 12 LG "
Parts & Supplies | Chipshooters / Chip Mounters
156370 BEARING RETAINING PLATE 156324 LINEAR GUIDE 156321 ATTACHMENT PLATE 156320 MOTOR SUPPORT PLATE 156249 BEARING CLAMP PLATE 156248 BEARING, CROSS ROLLER RB2508UUCC0 156228 PULLEY, DIA. 12 BORE 156220 LEADSCREW END NUT 156
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | San Diego, Michigan USA | Sales/Marketing
* Results driven Sales Executive combining expertise in Building Sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries * Extensive Field Sales experience with a tra
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
Application Of Build-in Self Test In Functional Test Of DSL SMTnet Express May 23, 2012, Subscribers: 25234, Members: Companies: 8880, Users: 33129 Application Of Build-in Self Test In Functional Test Of DSL First published in the 2012 IPC APEX
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/copy-of-chip-off-equipment-for-digital-forensics
Chip-Off Equipment for Digital Forensics Model 620 – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
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>> SMT Technical Size Does Matter – Breaking the Barriers of Wafer Level Packaging Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly
